Publications

25 results for Jennifer Church

Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- - Luciana Meli
  - Indira Seshadri
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Predicting and Measuring Scummed Contact Holes
- - Elisa Novelli
  - Chris A. Mack
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
High Volume Manufacturing Innovations for Metal-Oxide Resist Patterning
- - Nicholas Latham
  - Jennifer Church
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Wet clean oxidation for optimal line width and LER
- - Steven McDermott
  - Keith Donegan
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- - Daniel Edelstein
  - Son Nguyen
  - et al.
- 2024
- IEDM 2024
A novel single damascene process for via metal corrosion-free interconnects in advanced nodes
- - Koichi Motoyama
  - Dominik Metzler
  - et al.
- 2024
- IITC 2024
EUV patterned gate variation reduction in next generation transistor architectures
- - Gopal Kenath
  - Martin Burkhardt
  - et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Scaling opportunities for Gate-All-Around: A patterning perspective
- - I. Seshadri
  - E. Miller
  - et al.
- 2023
- IEDM 2023
Scaling opportunities for Gate-All-Around and beyond: A patterning perspective
- - Indira Seshadri
  - Eric Miller
  - et al.
- 2023
- IEDM 2023
Throughput vs. Yield: reviewing the metrology needs for stochastics-aware process window analysis (SA-PWA)
- - Jennifer Church
  - Luciana Meli
- 2022
- SPIE Advanced Lithography 2022